Advanced Processing and Manufacturing Technologies for Nanostructured and Multifunctional Materials II
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Advanced Processing and Manufacturing Technologies for Nanostructured and Multifunctional Materials II - Tatsuki Ohji
Preface
This CESP issue contains papers that were presented during three symposia held during the 39th International Conference and Exposition on Advanced Ceramics and Composites, Daytona Beach, Florida, January 25–30, 2015:
Symposium 8: 9th International Symposium on Advanced Processing and Manufacturing Technologies for Structural and Multifunctional Materials and Systems (APMT)
Focused Session 4: Additive Manufacturing and 3D Printing Technologies
Symposium 7: 9th International Symposium on Nanostructured Materials and Nanocomposites
Over 170 contributions (invited talks, oral presentations, and posters) were presented by participants from universities, research institutions, and industry, which offered interdisciplinary discussions indicating strong scientific and technological interest in the field of nanostructured systems. This issue contains 18 peer-reviewed papers that cover various aspects and the latest developments related to nano-scaled materials and functional ceramics.
The editors wish to extend their gratitude and appreciation to all the authors for their cooperation and contributions, to all the participants and session chairs for their time and efforts, and to all the reviewers for their valuable comments and suggestions. Financial support from the Engineering Ceramics Division of The American Ceramic Society (ACerS) and industry sponsors is gratefully acknowledged.
The invaluable assistance of the ACerS staff of the meetings and publication departments, instrumental in the success of the symposium, is gratefully acknowledged, We believe that this issue will serve as a useful reference for the researchers and technologists interested in science and technology of multifunctional or nanostructured materials and devices.
TATSUKI OHJI, Nagoya, Japan
MRITYUNJAY SINGH, Cleveland, USA
MICHAEL HALBIG, Cleveland, USA
Introduction
This CESP issue consists of papers that were submitted and approved for the proceedings of the 39th International Conference on Advanced Ceramics and Composites (ICACC), held January 25-30, 2015 in Daytona Beach, Florida. ICACC is the most prominent international meeting in the area of advanced structural, functional, and nanoscopic ceramics, composites, and other emerging ceramic materials and technologies. This prestigious conference has been organized by the Engineering Ceramics Division (ECD) of The American Ceramic Society (ACerS) since 1977.
The 39th ICACC hosted more than 1,000 attendees from 40 countries and over 800 presentations. The topics ranged from ceramic nanomaterials to structural reliability of ceramic components which demonstrated the linkage between materials science developments at the atomic level and macro level structural applications. Papers addressed material, model, and component development and investigated the interrelations between the processing, properties, and microstructure of ceramic materials.
The 2015 conference was organized into the following 21 symposia and sessions:
The proceedings papers from this conference are published in the below seven issues of the 2015 CESP; Volume 36, Issues 2-8, as listed below.
Mechanical Properties and Performance of Engineering Ceramics and Composites X, CESP Volume 36, Issue 2 (includes papers from Symposium 1)
Advances in Solid Oxide Fuel Cells and Electronic Ceramics, CESP Volume 36, Issue 3 (includes papers from Symposium 3 and Focused Session 5)
Advances in Ceramic Armor XI, CESP Volume 36, Issue 4 (includes papers from Symposium 4)
Advances in Bioceramics and Porous Ceramics VIII, CESP Volume 36, Issue 5 (includes papers from Symposia 5 and 9)
Advanced Processing and Manufacturing Technologies for Nanostructured and Multifunctional Materials II, CESP Volume 36, Issue 6 (includes papers from Symposia 7 and 8 and Focused Sessions 4 and 6)
Ceramic Materials for Energy Applications V, CESP Volume 36, Issue 7 (includes papers from Symposia 6 and 13 and Focused Session 2)
Developments in Strategic Ceramic Materials, CESP Volume 36, Issue 8 (includes papers from Symposia 2, 10, 11, and 12; from Focused Sessions 1 and 3); the European-USA Engineering Ceramics Summit; and the 4th Annual Global Young Investigator Forum
The organization of the Daytona Beach meeting and the publication of these proceedings were possible thanks to the professional staff of ACerS and the tireless dedication of many ECD members. We would especially like to express our sincere thanks to the symposia organizers, session chairs, presenters and conference attendees, for their efforts and enthusiastic participation in the vibrant and cutting-edge conference.
ACerS and the ECD invite you to attend the Jubilee Celebration of the 40th International Conference on Advanced Ceramics and Composites (http://www.ceramics.org/daytona2016) January 24-29, 2016 in Daytona Beach, Florida.
To purchase additional CESP issues as well as other ceramic publications, visit the ACerS-Wiley Publications home page at www.wiley.com/go/ceramics.
JINGYANGWANG, Institute of Metal Research, Chinese Academy of Sciences, Shenyang, China
SOSHUKIRIHARA, Osaka University, Osaka, Japan
Volume Editors
July 2015
Advanced Processing and Manufacturing
DEVELOPMENT OF HIGH TEMPERATURE JOINING AND THERMOMECHANICAL CHARACTERIZATION APPROACHES FOR SiC/SiC COMPOSITES
Michael C. Halbig¹, Mrityunjay Singh², and Jerry Lang¹
¹ NASA Glenn Research Center, Cleveland, OH
² Ohio Aerospace Institute, Cleveland, OH
ABSTRACT
Advanced joining technologies are enabling for the fabrication of large and complex shaped silicon carbide-based ceramic and ceramic matrix composite components to be utilized in high temperature extreme environment applications. Many joining approaches are being proposed and developed. New standardized tests are needed to fully characterize joint properties and capabilities. One such test ISO-13124, was used for mechanical testing in this work. This test configuration allows for testing of joined crossbars in either a tensile or a shear stress state. The REA Bond joining approach using Si-8.5%Hf eutectic phas ealloy was used to join ceramic matrix composite and monolithic silicon carbide materials. In mechanical testing, low strengths were obtained with failures occurring in the joined substrates. Finite element analysis of the stress states revealed stresses concentrations at the edges of up to 30 times higher than the 2 MPa nominal stress for the tensile state. For the shear state, out of plane displace ments occurred.
INTRODUCTION
Silicon carbide fiber reinforced / silicon carbide matrix composites (SiC/SiC) are a class of ceramic matrix composite (CMC) materials are being developed for turbine engine applications for such components as combustor liners, shrouds, vanes, and blades¹-⁴. These CMC components can operate at higher temperatures, require less cooling, and are lighter weight than metal components. The use of CMCs in such applications contributes to increased turbine engine fuel efficiencies, reduced emissions, and long term durability. As interest in fiber reinforced SiC-based composite materials continues to grow due to advancements in their properties, new integration technologies and testing capabilities will be critically needed.
In order to evaluate the mechanical properties of joints, standardized tests and testing capabilities are needed. One such standardized test⁵, BS-ISO-13124:2011, Fine ceramics (advanced ceramics, advanced technical ceramics): Test method for interfacial bond strength of ceramic materials,
was applied for evaluation of mechanical properties of monolithic SiC and SiC/SiC materials joined to themselves. In this test, two long rectangular substrates are bonded across one another at their midsection to form an X
shaped crossbar to provide samples for testing either in a tensile stress state or a shear stress state. Due to the need for multiple crossbars for testing and because of the uniques hape, a simple joining approach was needed for processing the joints. The authors had previously reported a diffusion bonding approach for joining SiC based materials using titanium interlayers⁶-⁷. However, such an approach needs relatively smooth surfaces and requires high applied loads from a hot press to aid in bond formation. Another joining approach, Refractory Eutectic Assisted BONDing (REABOND) was used for evaluating joints ac cording to ISO-13124. REABond uses Si-8.5Hf eutectic phase allow powder in a green tape for the joining interlayer. During joint processing, no load is needed and the eutectic phase melts to flow over the substrate surface and solidifies during cooling. REBOND has been demonstrated on the joining of SiC/SiC composites resulting dense, crack free joints that filled the contour of the rough CMC surface⁸.
Joining of SiC/SiC substrate s and monolithic SiC was conducted to support the mechanical test method development. Micros tructural analysis was conducted using optical microscopy and scanning electron microscopy (SEM) coupled with energy dispersive spectroscopy (EDS) to evaluate bond quality. Mechanical tests were conducted at room temperature according to ISO-13124 for testing joints under tensile or shear stress conditions.
In correl ation to the experimental tests, the test standard was evaluated in a finite element model investigation. The purpose of the investigation was to determine the reliability of the interfacial bond strength test for two types of test methods for the ISO-13124, by characterizing the stress state within the bond region by finite element methods. The objective was to determine the stress concentration within the bond region so that a more accurate stress me asure ment can be determined from the experimental test results of the tensile and shear specimens. Knowing this stress state would better characte rize the strength of the ceramic bond and would he lp determine if any modifications were needed to the specimen and/or test setup while still remaining compliant to the ISO-13124 standard for fine and advance ceramics interfacial bond strength test method.
EXPERIMENTAL
The CMCs were two different types of silicon carbide fiber/silicon carbide matrix (SiC/SiC) CMCs. The first CMC was SiC/SiC HiPerComp™ Gen II by GE Energy (Newark, DE). The SiC fibers were Hi-Nicalon Type-S. The SiC matrix was manufactured by the prepreg melt infiltration method⁹. The second CMC was melt infiltrated (MI) SiC/SiC fabricated by Goodrich Corporation (CA) using Hi -Nicalon SiC fibers with a BN/SiC interface. Both Si C/Si C materials had a 0°/90° woven fiber tow architecture. Due to lower than expected mechanical strength results from the joined CMC materials, joining of monolithic SiC substrates was also conducted. The purpose was to eliminate the added complicati on of low interlaminar properties which are typical of CMCs.
REABond green tapes were prepare d for use as the interlayer for joining. Previously several eutectic phase alloys were evaluated and the Si-8.5Hf eutectic phase alloy was down-selected as giving the best results for joining CMCs⁸. For the current effort, powders of less than 70 microns in diameter of the Si-8.5Hf eutectic phase alloy were mixed with binders to prepare the green tapes by tape casting. The tapes had a solid loading of about 30-35% and were 0.21 mm thick. A second set of tapes were prepared with 5 wt.% of SiC nanofibers integrated in with the eutectic powders. The SiC nanofibers were approximately 0.15 microns in diameter and 10 microns in length. The SiC nanofibers were produced at NASA GRC¹⁰.
The substrates were rectangular bar shapes that had been machined from larger coupons. Joining of two bars at the crossover of their midsection as illustrated in Figure 1, forms the cross-bar shape for testing according to the ISO-13124 standard. The test standard recommends test bars that have dimensions of 12 mm × 4 mm × 4 mm. The test standard and the recommended sample size was developed for standardized testing of monolithic ceramics. However, since the standard is being applied here to the testing of CMCs, the small 4 mm × 4 mm crossover area was increased so that repeating unit cells of the fiber architecture could be present within the bond area to maximize the benefit of the fiber architecture. Therefor the bar size was doubled to 24 mm × 8 mm × 8 mm. However, actual dimensions of the CMC test bars varied due to the sizes of available CMC coupons. The dimensions in the length × width × height were roughly 24 mm × 6 mm × 2 mm for the GE SiC/SiC, 24 mm × 8 mm × 2.5 mm for the BFG SiC/SiC, and 33 mm × 6.4 mm × 3.2 mm for the monolithic SiC material.
Green tapes of each type, with nanotubes and without, were cut to match the mating surface area of the substrates being joined. Multiple layers of the green tape were used to achieve an interl ayer thickness sui table for filling in the surface voids of the paired substrates which arise due to surface roughness from the fiber architecture. Therefore, two green tapes were used to join the GE SiC/SiC and SiC monolithic materials since they were relatively smooth while three green tapes were stacked for use as the interlayer in joining the BFG SiC/SiC material which had a rougher surface. The fixture used to position the substrate s for joining is shown in Figure 1. Joint processing was conducted in a vacuum furnace at 1375°C with a 5 minute hold. A sl ow, stepped heating rate was used to burn-off the organic binders in the eutectic tape. The microstructures of polished cross-sections of the resulting joints were analyzed using an optical microscope and a field emission scanning electron microscope (FE SEM) coupled with energy dispersive spectroscopy (EDS) for elemental analysis of reaction formed phases in the joint.
Figure 1. Image of the processing fixture that was used to join two overlapping substrates to form the crossbar configuration needed for testing according to ISO-13124. Witness samples were also joined for conducting microscopy (sample in the upper right).
The joined crossbars were tested according to the ISO-13124 standard. Figure 2 shows illustrations of the sample loading and of the crossbar configuration in the fixtures during testing for the tensile stress state (top) and the shear stress state (bottom). Fractography using a scanning electron microscope was conducted on fracture surfaces of failed samples. In some cases, failure did not occur at the joint and the joint region remained intact. In these cases, macrographs were taken to capture the failure location.
Figure 2. Illustration of the sample loading (left) and the position of the samples in the test fixtures (right) for the tensile stress state (top) and for the shear stress state