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Overcoming Technological Challenges in the PCB Industry

Overcoming Technological Challenges in the PCB Industry

FromOnTrack: The PCB Design Podcast


Overcoming Technological Challenges in the PCB Industry

FromOnTrack: The PCB Design Podcast

ratings:
Length:
37 minutes
Released:
Oct 4, 2022
Format:
Podcast episode

Description

Matt Kelly is the  Chief Technologist at IPC. In this episode we will discuss all about the technological challenges the industry is facing. Matt will help us understand the “ecosystem” involving the semiconductor industry, advanced packaging, and IC substrates.
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Check the show notes and additional resources below.
Show Highlights:
Matt Kelly’s role as the Chief Technologist at IPC
The Moore's Law is continuing, but it is economically becoming difficult to maintain, this has become the driving force behind heterogeneous integration 
What does the CHIPS Act really mean for manufacturers?
Production of semiconductors is an expensive business–one fabrication infrastructure can cost an average of 20 billion dollars
Matt stresses the need in the industry to use, and understand the “ecosystem” involving the semiconductor industry, advanced packaging, and IC substrates
The US has a 20-year market leader, knowhow gap, weak sub-tier supply, skilled workforce shortage, and lack of raw materials
The industry needs to spend time looking at the big picture, take the bigger messages, and convert them into actual change
A significant shift in the workforce–PCB designers are a scarce commodity. In the near future, printed circuit board designers may have to double as IC substrate designers
The global supply chain is alive and well, a change to a regional and global mindset is necessary to overcome most of the industry challenges
Matt shares the same scenario with produce shoppers in the summertime, you try to buy your fresh fruits and vegetables locally from your local farmers or whatever, but yet you still go to the grocery store


IPC’s focus is on increasing workforce skills development in the areas of design and assembly
IPC is sponsoring the Advanced Packaging Symposium, Building the Substrate and Packaging Assembly Ecosystem in Washington, DC, on October 11th and 12th



Links and Resources:
Follow Matt Kelly on LinkedIn
Learn more about the IPC’s Advanced Packaging Symposium, Building the Substrate and Packaging Assembly Ecosystem
Watch related podcast episode:
    The Benefits of Diversifying PCB Industry Supply Chain
    IPC CEO John Mitchell on the Supporting American Printed Circuit Boards Act
    What is in the PCB Bill?
Connect with Zach on LinkedIn
Full OnTrack Podcast Library
Altium Website
 
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Released:
Oct 4, 2022
Format:
Podcast episode

Titles in the series (97)

The PCB Design Podcast features conversations on all facets of PCB Design and Hardware Development