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The Many Benefits of Additive Process in PCB Manufacturing
The Many Benefits of Additive Process in PCB Manufacturing
ratings:
Length:
33 minutes
Released:
Apr 5, 2022
Format:
Podcast episode
Description
In this episode, we will continue with the topic of Design WITH Manufacturing, and joining us is Mike Vinson, the Chief Operating Officer at Averatek. Mike will help us understand Averatek’s advanced PCB manufacturing processes, including the technology and chemistry behind A-SAP and 3D printing.
Altium 365: Where the World Designs Electronics
Watch the video, click here.
Show Highlights:
Mike Vinson's background
Mike explains what is an Additive Process
A-SAP–a semi-additive process used to make very fine features for high definition, and high density interconnects on print circuit boards.
The ability to add metalization other than copper, such as platinum, gold, palladium
3D printing–a fully-additive process where all of the material is just added on, and nothing is subtracted away
Averatek’s business’s scope
Licensing the technology and selling the chemistry
The current clientele is North America
Efficient and secure prototyping
Is the 3D surface solderable?
MIDs or molded interconnect devices, are cool, but are they affordable?
Tara Dunn, Averatek’s VP in Marketing, is the primary point of contact for licensing
Tara is also one of Altium’s Industry Expert contributor
What’s in the Averatek’s IPC Paper
What does the economy look like for A-SAP technology? Will it be accessible, and cost-effective?
Mikes talks about the scalability of materials set in A-SAP technology
How can PCB designers take advantage of the A-SAP capabilities so that they can create more compact, smaller features, more advanced products?
How about a transparent substrate? Averatek has worked with transparent polyimides and has done some other transparent substrates
What are the things to look forward to in additive processes and the additive manufacturing realm in general?
Links and Resources:
Connect with Mike Vinson on LinkedIn
Visit Averatek's website
Check out Tara Dunn’s Articles on Altium Resource Hub
Watch Previous Episode Mike Vinson:
Sub-25 Micron Traces with Averatek ASAP Technology
Semi-Additive Process Technology at Averatek
Connect with Zack on LinkedIn
Full OnTrack Podcast Library
Altium Website
Download your Altium Designer Free Trial
Learn More about Altium Nexus
Altium 365: Where the World Designs Electronics
Altium 365: Where the World Designs Electronics
Watch the video, click here.
Show Highlights:
Mike Vinson's background
Mike explains what is an Additive Process
A-SAP–a semi-additive process used to make very fine features for high definition, and high density interconnects on print circuit boards.
The ability to add metalization other than copper, such as platinum, gold, palladium
3D printing–a fully-additive process where all of the material is just added on, and nothing is subtracted away
Averatek’s business’s scope
Licensing the technology and selling the chemistry
The current clientele is North America
Efficient and secure prototyping
Is the 3D surface solderable?
MIDs or molded interconnect devices, are cool, but are they affordable?
Tara Dunn, Averatek’s VP in Marketing, is the primary point of contact for licensing
Tara is also one of Altium’s Industry Expert contributor
What’s in the Averatek’s IPC Paper
What does the economy look like for A-SAP technology? Will it be accessible, and cost-effective?
Mikes talks about the scalability of materials set in A-SAP technology
How can PCB designers take advantage of the A-SAP capabilities so that they can create more compact, smaller features, more advanced products?
How about a transparent substrate? Averatek has worked with transparent polyimides and has done some other transparent substrates
What are the things to look forward to in additive processes and the additive manufacturing realm in general?
Links and Resources:
Connect with Mike Vinson on LinkedIn
Visit Averatek's website
Check out Tara Dunn’s Articles on Altium Resource Hub
Watch Previous Episode Mike Vinson:
Sub-25 Micron Traces with Averatek ASAP Technology
Semi-Additive Process Technology at Averatek
Connect with Zack on LinkedIn
Full OnTrack Podcast Library
Altium Website
Download your Altium Designer Free Trial
Learn More about Altium Nexus
Altium 365: Where the World Designs Electronics
Released:
Apr 5, 2022
Format:
Podcast episode
Titles in the series (97)
3D Printing Circuit Boards for Fast Prototyping: Let’s talk about the future of printed circuit board prototyping. Sean Patterson, the President of Nano Dimension USA is here to introduce the technology behind DragonFly IV®, the multi-material 3D printer for electronics fabrication. He will walk us... by OnTrack: The PCB Design Podcast