Modern Approaches to Discrete, Integrated Component and System Reliability Engineering: Reliability Engineering

By Mr. John Jay

This book covers the, methodology and processes required for a successful new product system, component and device development reliability.
This book covers introductory definition of reliability terms and gradually build reliability and develop models from components, systems, software reliability and show case study examples of how these methodologies are used was illustrated.
This book is the outgrowth of my over 22 years of professional engineering experience in semiconductor industry and systems. This book unlike any other textbook on the subject, presents the processes of reliability engineering conceptually, and with minute details to encourage understanding and assimilation of the material and to show how the concept of reliability is translated from mathematical probability to full product reliability testing.
This book bridges the gaps of reliability introduced by the rapid semiconductor advances, process miniaturization, new package and material advances and attempts to shorten new product development, and manufacturing release cycles.

• Language: English
• Publisher: Xlibris US
• Release date: Feb 2, 2016
• ISBN: 9781514451366

Mr. John Jay

The author is Registered Professional Engineer in Electrical Engineering for over 18years with State of California, author has Bachelor’s degree in Electrical Engineers, Master’s degree in Information Technology, has completed some Doctoral working on Dissertation. The author has over 22 years of professional engineering experience in semiconductor industry, systems and medical devices. The author has worked at over six different companies, including Signetics, National Semiconductor, Fujitsu Microelectronics, GE Healthcare, Intel corporation, Cisco Systems, Accuray Systems and has been responsible for over 20 different new products, systems and medical devices and worked with over 30 different semiconductor processes, assembly, over six different semiconductor foundry many PWB vendors, assembly and test houses. This book is the outgrowth of the authors over 22 years of industrial and professional experience and serves as the authors contribution to Engineering and professional body of knowledge and benefit to mankind quality of life

Book preview

Copyright © 2016 by John Jay.

Library of Congress Control Number:   2016900867

ISBN:      Hardcover      978-1-5144-5138-0

                Softcover         978-1-5144-5137-3

                eBook              978-1-5144-5136-6

All rights reserved. No part of this book may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying, recording, or by any information storage and retrieval system, without permission in writing from the copyright owner.

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Rev. date: 01/29/2016

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CONTENTS

Preface

Acknowledgement

Chapter 1: Introduction, Definitions, Bathtub Curve, Weibull / Exponential Model

Chapter 2: Failure Rate Model, FIT Rate Estimation

Chapter 3: Thermal Design Characterization, Derating Factors, Wafer Level Reliability

Chapter 4: HALT /HASS, FMEA and FMECA, ESS, Pre Silicon Reliability

Chapter 5: Component Reliability, Capacitor, Resistors, Inductors, Ball Bearing

Chapter 6: Software Reliability, Software Reliability Models

Chapter 7: Reliability Hardware Design, ESD, Latch Up Characterization

Chapter 8: System Reliability Case Study, Solar Inverter, Radio Surgery Equipment

Glossary Of Terms

References

About The Author

PREFACE

Need For Modern Approach to Integrated System and Component Reliability Engineering

Semiconductor industry is growing at a remarkable pace with over 15% sustained annual growth over the last 50 years. This rapid advancement follows Moore's law which stated that integrated circuit complexity, performances doubles every18 months accompanied similarly, by a reduction in cost per function.

These rapid growth in semiconductor industry, the miniaturization of the process technologies, advanced packaging technologies, advances in new materials and methodologies, for examples copper metallization, Shallow Trench Isolation(STI), Chemical Mechanical Polishing(CMP) and more introduces additional challenges in new product developments, product manufacturing, product design, product test reliability engineering, failure analysis, packaging, quality assurance and in all aspects of product development and release cycles.

New challenges include minimizing TDP power dissipation, leakages and developing solution 6T and 8T Static RAM low voltage sensitivity and column failures.

These challenges and the need to speed up product development pace, reduce time to market, improve yield, reduce defect density and cost require engineers that are knowledgeable in product development and manufacturing to overcome some of the short falls, some of the obstacles that often hinder product development, new product introduction, new product qualification, new product release and ramp up to full production.

The scope and goal of this book is to cover the steps, methodology and processes required for a successful new product system, component and device development reliability. This book covers introductory reliability definition of terms and gradually build reliability models from Components, systems, software reliability and case study examples of how the methodology are used.

The Need For This Book

The book is the outgrowth of my 22 years of professional engineering experience in semiconductor industry. Working at over six different companies, responsible for over 20 different new products, systems and medical devices and worked with over 30 different semiconductor processes, assembly, over six different semiconductor foundry many PWB vendors, assembly and test houses; I am of the opinion that sound Engineering Education prepares the engineer for the challenges of the professional and serves as a basis for competition. Actual Engineering Practice is learned on the job and it takes about 5years to fully develop an Engineer; Advance degree increases in the learning curve; this book therefore serves to bridge the gap between class room learning and practical Engineering Practice, with practical examples for Reliability Engineering

The book unlike any other textbook on the subject, presents the processes of reliability engineering conceptually, and with minute details to encourage understanding and assimilation of the material. For example the subject of product characterization was cover very well such that a new engineer or those who do not fully understand how a the concept of reliability is translated from mathematical probability full product reliability and warranty estimation

No other textbooks on the subject have complete treatment or addressed the issues that arise out of the product developments, new product reliability issues or new product releases problems in one comprehensive volume.

This book is needed to bridge the gaps or the pitfalls that existed or was introduced by the rapid semiconductor advances, process miniaturization, new package and material advances and attempts to shorten new product development, and manufacturing release cycles, with the goal of time to market reduction.

Targeted Audience

The material in this text book is intended for all Engineers in semiconductor industry, in private practice, students and professors. Design, Product, Test, Reliability, Manufacturing, Quality Assurance, Project Engineers, Managers, Directors of product and manufacturing will find the material in this text book very helpful in their daily task this book could be a good reference for any professional engineer in practice to have.

Chapter 1 covers the definition of key terms, series and parallel reliability

Developments. Chapter 1 outline types of Reliability, Series, Parallel &Component and System Reliability

Chapter 2 cover reliability failure rate model, failure rate estimation and sample Size determination, and reliability model

Chapter 3 covers thermal characterization, derating factors, bathtub curve and (Weibull, Exponential Model).

Chapter 4 covers FMEA (Failure Mode Effect & Analysis) & FMECA (Failure Effect & Criticality Analysis) Pre-Silicon (DfR, DfX) and Wafer Level Reliability.

Chapter 5 Covers Component Reliability (Capacitor, Inductor, Resistor, Transistor, IC), Package Reliability (BGA, FLIP CHIP, WAFER LEVEL Packages), Electromechanical System Reliability (Fan, Electric Motor, Ball Bearing)

Chapter 6 covers Software Reliability, System Reliability Case Studies Radio Surgery Equipment Case Study and Solar Inverter Reliability

Chapter 7 covers Board Level Reliability Case Study, ESS /HALT --HASS Reliability Reliability Hardware Design,

ACKNOWLEDGEMENT

I will like to use this opportunity to acknowledge some people who indirectly or directly influenced my writing of this book: John Le Gall, Reliability Engineering Manager, formerly at Signetics, but now retired who guided me through my initial professional experience as a young engineer that recently graduated from college, my colleagues at National Semiconductor, Tom Hoatson of NSC South Portland Maine, Steve Joyce Manager NSC, Paul Cardarelli, Director of Product and Quality Engineering at Fujitsu Microelectronics to whom I first discussed the idea of writing this book with, Dr. Chris Nguyen Component Engineering Manager, Dr. Bok Shin Manufacturing Engineering Manager and Dr. Song Lin Chang my colleague at Fujitsu Microelectronics. Dr. Tyrone Benson Inter Corporation and Lawrence Heywood Manager INTEL.

Last but not the least, I would like to acknowledge my wife Catherine, ex-wife Starr, step daughter Stacy (who was