Pics of Apple M1 Max die hint at future chiplets
Jan 24, 2022
2 minutes
It appears that Apple has kept a closely-guarded secret regarding its new M1 Max silicon. New pics of the underside of the chip reveal that it may actually have an interconnect bus that enables Multi-Chip-Module (MCM) scaling, allowing the company to stack together multiple dies in a chiplet-based design. That could result
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