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This Year’s Model | Intel’s & Leti’s Trans-Atlantic Packaging | First Worm

This Year’s Model | Intel’s & Leti’s Trans-Atlantic Packaging | First Worm

FromEE Times Current


This Year’s Model | Intel’s & Leti’s Trans-Atlantic Packaging | First Worm

FromEE Times Current

ratings:
Length:
20 minutes
Released:
Nov 6, 2020
Format:
Podcast episode

Description

The Weekly Briefing podcast: It is almost impossible to create a modern product in a reasonable amount of time without models of hardware, or models of software, or – increasingly – models of both before anything is actually built or coded. How that works in practice is one of the marvels of modern engineering. A discussion with Altair SVP Pete Darnell. Also, Leti in France just began collaborating with Intel on advanced chip packaging. A discussion with EE Times newest contributor, Don Scansen.
Released:
Nov 6, 2020
Format:
Podcast episode

Titles in the series (100)

EE Times Current provides a deep dive into the most compelling stories in the electronics industry. Tune in to keep yourself current on what matters to design engineers and other tech industry professionals