30 min listen
This Year’s Model | Intel’s & Leti’s Trans-Atlantic Packaging | First Worm
FromEE Times Current
ratings:
Length:
20 minutes
Released:
Nov 6, 2020
Format:
Podcast episode
Description
The Weekly Briefing podcast: It is almost impossible to create a modern product in a reasonable amount of time without models of hardware, or models of software, or – increasingly – models of both before anything is actually built or coded. How that works in practice is one of the marvels of modern engineering. A discussion with Altair SVP Pete Darnell. Also, Leti in France just began collaborating with Intel on advanced chip packaging. A discussion with EE Times newest contributor, Don Scansen.
Released:
Nov 6, 2020
Format:
Podcast episode
Titles in the series (100)
CES 2019 Special: Interview with Jesse Will, Rolling Stone (PT2) by EE Times Current