AMD Starts to Stack
Jul 20, 2021
3 minutes
‒CL
HEN AMD attends an event to show off its new gear, you won’t come away disappointed. At this year’s Computex trade show in Taiwan, AMD’s CEO, Lisa Su, showed us what she called “the next big step forward” in advanced chip packaging. AMD has been working with TSMC and its 3DFabric technology to combine chiplet packaging with die stacking to create a 3D chiplet architecture. The first application of this will be a 3D vertical cache, stacking memory chips
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